Low-temperature flower packaging materials unveiled in Japan
Japan Corrugated Paperboard Co., Ltd. and Tokiwa Mori Manufacturing Co., Ltd. have jointly launched Packaging Materials for low temperature transportation of flowers, foods and other uses. According to reports, the researchers used a synthetic resin foam film to make a corrugated center part. The center part of the groove was set at a certain distance, and then the two sides of the center part of the sticker board liner, to improve the thermal insulation performance of traditional packaging. Poor, fresh-keeping effect is not ideal shortcomings. Compared with ordinary corrugated paper, it has high heat insulation, air permeability and moisture resistance, it can be folded and can be reused. It has good printing properties in terms of external packaging and has a good market prospect.